SIC Wafer Polishing Market to Reach USD 4.57 Billion by 2030 owing to Rising Adoption of Power Electronics

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sic wafer polishing market size

SIC Wafer Polishing Market Size

SIC Wafer Polishing Market Size, Share, Growth, Trend, Global Industry Overview and Regional Analysis, Forecast 2023 – 2030

AUSTIN, TEXAS, UNITED STATES, February 13, 2024 / — đŒđšđ«đ€đžđ­ đ‘đžđ©đšđ«đ­ đ’đœđšđ©đž & đŽđŻđžđ«đŻđąđžđ°

The SIC Wafer Polishing Market, with a valuation of USD 0.36 billion in 2022, anticipates significant growth, projecting an expansion to USD 4.57 billion by 2030. This growth trajectory is expected to be driven by a robust Compound Annual Growth Rate (CAGR) of 37.4% over the forecast period spanning from 2023 to 2030.

In the realm of semiconductor manufacturing, the process of Silicon Carbide (SIC) wafer polishing plays a pivotal role in enhancing the quality and efficiency of semiconductor devices. The scope of SIC wafer polishing market encompasses a meticulous procedure aimed at achieving optimal surface smoothness and precision, crucial for the performance of semiconductor components. This process involves the utilization of advanced abrasive materials and innovative polishing techniques to attain the desired flatness and eliminate imperfections on the SIC wafer surface.

𝐆𝐞𝐭 đ…đ«đžđž đ’đšđŠđ©đ„đž đ‘đžđ©đšđ«đ­ 𝐹𝐟 𝐒𝐈𝐂 đ–đšđŸđžđ« đđšđ„đąđŹđĄđąđ§đ  đŒđšđ«đ€đžđ­ @

𝐊𝐞đČ đđ„đšđČđžđ«đŹ đ‚đšđŻđžđ«đžđ 𝐱𝐧 𝐒𝐈𝐂 đ–đšđŸđžđ« đđšđ„đąđŹđĄđąđ§đ  đŠđšđ«đ€đžđ­ đ«đžđ©đšđ«đ­ đšđ«đž:

– Kemet International (UK)
– Entegris (US)
– Iljin Diamond (US)
– Fujimi Corporation (Japan)
– Saint-Gobain (US)
– JSR Corporation (Japan)
– Engis Corporation (US)
– Ferro Corporation (US)
– 3M (US)
– SKC (South Korea)
– DuPont Incorporated (US)
– Fujifilm Holding America Corporation (US).

The overview of SIC wafer polishing market underscores its significance in ensuring the production of high-performance electronic devices by refining the key substrate upon which integrated circuits are built. Key considerations in this process involve abrasive selection, polishing parameters, and post-polishing treatments, all contributing to the overall quality and reliability of semiconductor wafers. As technological advancements continue to propel the global semiconductor industry, the demand for SIC (silicon carbide) wafers intensifies, given their critical role in various electronic applications.

Electric Mobility and 5G Revolution Drive Explosive Growth in SIC Wafer Polishing Market

The automotive industry’s shift towards electric mobility is a significant growth driver for the SIC wafer polishing market. Silicon carbide wafers are integral in the production of power electronics for EVs, offering enhanced efficiency and performance compared to traditional silicon wafers. The increasing adoption of power electronics across diverse industries, including renewable energy, aerospace, and telecommunications, contributes to the market’s growth. SIC wafers exhibit superior thermal conductivity and power handling capabilities, making them ideal for power electronic applications. The global rollout of 5G technology is a catalyst for the SIC wafer polishing market. Silicon carbide’s unique properties make it an attractive choice for high-frequency and high-power components in 5G infrastructure, fostering the demand for polished SIC wafers.

One of the primary challenges for the SIC wafer polishing market is the relatively high production costs associated with silicon carbide wafers. The intricate manufacturing processes and the cost of raw materials contribute to elevated production expenses, hindering widespread adoption. Investments in research and development to enhance manufacturing processes and reduce production costs present a promising opportunity. Innovations in material synthesis and wafer polishing techniques can drive advancements in the SIC wafer polishing market. Forming strategic alliances with raw material suppliers, technology developers, and end-user industries can unlock new avenues for growth. Collaborations can streamline the supply chain, mitigate risks, and foster innovation in the SIC wafer polishing ecosystem.

Regional Analysis

The regional analysis of the SIC wafer polishing market delves into the geographical nuances shaping its dynamics. Variances in technological adoption, regulatory landscapes, and market maturity levels across regions contribute to the diverse market scenario. For instance, Asia-Pacific remains a key hub for semiconductor manufacturing, driving the demand for SIC wafer polishing. Meanwhile, North America and Europe showcase a focus on innovation and research in polishing technologies. Understanding these regional intricacies is vital for market players to formulate effective strategies tailored to the unique characteristics of each market segment.

𝐁𝐼đČ đ‚đšđŠđ©đ„đžđ­đž đ‘đžđ©đšđ«đ­ 𝐚𝐭 𝐃𝐱𝐬𝐜𝐹𝐼𝐧𝐭𝐞𝐝 đđ«đąđœđž @

𝐒𝐈𝐂 đ–đšđŸđžđ« đđšđ„đąđŹđĄđąđ§đ  đŒđšđ«đ€đžđ­ 𝐒𝐞𝐠𝐩𝐞𝐧𝐭𝐚𝐭𝐱𝐹𝐧 𝐚𝐬 đ…đšđ„đ„đšđ°đŹ:

By Process Type
‱ Mechanical polishing
‱ Chemical-mechanical polishing (CMP)
‱ Electropolishing
‱ Chemical polishing
‱ Plasma-assisted polishing
‱ Others

By Product Type
‱ Abrasive powders
‱ Polishing pads
‱ Diamond slurries
‱ Colloidal silica suspensions
‱ Others

By Application
‱ Power Electronics
‱ Light-emitting diodes (LEDs)
‱ Sensors and detectors
‱ RF and microwave devices
‱ Others

Segmentation by Region:
‱ North America
‱ Europe
‱ Asia-Pacific
‱ The Middle East & Africa
‱ Latin America

Impact of Recession

The ongoing recession has brought about a mixed impact on the SIC wafer polishing market. On one hand, reduced consumer spending and economic uncertainties have led to a temporary slowdown in semiconductor demand, affecting the market adversely. On the other hand, the recession has prompted manufacturers to reassess and optimize their production processes, potentially driving the adoption of cost-effective SIC wafer polishing solutions. This dichotomy presents both challenges and opportunities, emphasizing the need for market players to adapt to the evolving economic landscape.

Impact of Russia-Ukraine War

The Russia-Ukraine war has introduced a layer of geopolitical complexity that may influence the SIC wafer polishing market. Disruptions in the global supply chain, fluctuations in raw material prices, and potential shifts in trade dynamics could impact the semiconductor industry at large, affecting the SIC wafer polishing market. Additionally, uncertainties surrounding energy resources and geopolitical tensions may lead to market volatility, necessitating adaptive strategies for sustained growth and resilience in the face of geopolitical challenges.


In its comprehensive report on the SIC wafer polishing market, SNS Insider provides an in-depth analysis covering crucial aspects such as market trends, key players, technological advancements, and future prospects. The report explores the market’s competitive landscape, offering insights into the strategies employed by leading companies. Additionally, it addresses emerging challenges and opportunities, providing stakeholders with a holistic understanding of the market’s current state and its potential evolution. SNS Insider’s report serves as a valuable resource for industry professionals, investors, and decision-makers seeking to navigate the dynamic landscape of the SIC wafer polishing market.

đ“đšđ›đ„đž 𝐹𝐟 𝐂𝐹𝐧𝐭𝐞𝐧𝐭 – đ€đ§đšđ„đČ𝐬𝐱𝐬 𝐹𝐟 𝐊𝐞đČ 𝐏𝐹𝐱𝐧𝐭𝐬

1. Introduction
2. Research Methodology
3. Market Dynamics
4. Impact Analysis
5. Value Chain Analysis
6. Porter’s 5 forces model
7. PEST Analysis
8. SIC Wafer Polishing Market Segmentation, By Process Type
9. SIC Wafer Polishing Market Segmentation, By Product Type
10. SIC Wafer Polishing Market Segmentation, By Application
11. Regional Analysis
12. Company Profile
13. Competitive Landscape
14. USE Cases and Best Practices
15. Conclusion


𝐀𝐜𝐜𝐞𝐬𝐬 đ‚đšđŠđ©đ„đžđ­đž đ‘đžđ©đšđ«đ­ đƒđžđ­đšđąđ„đŹ 𝐰𝐱𝐭𝐡 đ…đźđ„đ„ 𝐓𝐎𝐂 𝐚𝐧𝐝 đ†đ«đšđ©đĄđŹ @

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